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CY7C1614KV18-333BZXI

Cypress Semiconductor Corporation

Cypress Semiconductor Corporation CY7C1614KV18-333BZXI
  • ECCN
    3A991.B.2.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B165
  • Memory Width
    36
  • Organization
    4MX36
  • Package Code
    BGA
  • JESD-609 Code
    e1
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    150994944 bit
  • Memory IC Type
    QDR SRAM
  • Operating Mode
    SYNCHRONOUS
  • Number of Words
    4194304 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN SILVER COPPER
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    PIPELINED ARCHITECTURE
  • Number of Functions
    1
  • Number of Terminals
    165
  • Number of Words Code
    4M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    1.9 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    1.8 V

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CY7C1614KV18-333BZXI