CY7C1362B200AXC by Cypress Semiconductor Corporation | Sourcengine

Cypress Semiconductor Corporation CY7C1362B200AXC

Lifecycle status
Discontinued
RoHS
RoHS compliant
REACH
REACH compliant
Description
Application Specific SRAM, 512KX18, 3ns, CMOS, PQFP100
Category
Semiconductors Memory ICs SRAMs APPLICATION SPECIFIC SRAM

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-PQFP-G100
Memory Width
18
Package Code
QFP
Package Shape
RECTANGULAR
Package Style
FLATPACK Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e4
Memory IC Type
APPLICATION SPECIFIC SRAM
Operating Mode
SYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
NICKEL PALLADIUM GOLD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Memory Organization
512KX18
Number of Terminals
100
Terminal Pitch (mm)
0.635
Access Time-Max (ns)
3
Number of Words Code
512K
Memory Density (bits)
9437184
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Number of Words (words)
524288
Standby Current-Max (A)
0.03
Standby Voltage-Min (V)
3.14
Supply Current-Max (mA)
220
Package Equivalence Code
QFP100,.63X.87
Clock Frequency-Max (MHz)
200
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
40