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CY14B116M-ZSP25XIT

Cypress Semiconductor Corporation

Cypress Semiconductor Corporation CY14B116M-ZSP25XIT
  • ECCN
    3A991.B.2.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • JESD-30 Code
    R-PDSO-G54
  • Memory Width
    16
  • Package Code
    TSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    NON-VOLATILE SRAM
  • Terminal Finish
    PURE TIN
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    1MX16
  • Number of Terminals
    54
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    25
  • Number of Words Code
    1M
  • Memory Density (bits)
    16777216
  • Package Body Material
    PLASTIC/EPOXY
  • Number of Words (words)
    1048576
  • Standby Current-Max (A)
    0.00075
  • Supply Current-Max (mA)
    95
  • Package Equivalence Code
    TSOP54,.46,32
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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CY14B116M-ZSP25XIT