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CXD2931GA-9

Sony Corporation

Sony Corporation CXD2931GA-9
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    13
  • Length (mm)
    13
  • JESD-30 Code
    S-PBGA-BU144
  • Package Code
    LFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BUTT
  • J-STD-609 Code
    e4
  • Telecom IC Type
    TELECOM CIRCUIT
  • Terminal Finish
    Gold (Au)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    144
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.4
  • Supply Voltage-Nom (V)
    3.3
  • Package Equivalence Code
    LGA144,15X15,32
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    10

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CXD2931GA-9
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CXD2931GA-9