ProductsManufacturers
Events
Send an RFQBOM Tool

CS26LV32163ZIP70

Chiplus Semiconductor Corp.

Chiplus Semiconductor Corp. CS26LV32163ZIP70
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    X-XUUC-N
  • Memory Width
    16
  • Package Code
    DIE
  • Package Shape
    UNSPECIFIED
  • Package Style
    UNCASED CHIP Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory IC Type
    PSEUDO STATIC RAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    UPPER
  • Memory Organization
    2MX16
  • Number of Functions
    1
  • Access Time-Max (ns)
    70
  • Number of Words Code
    2M
  • Memory Density (bits)
    33554432
  • Package Body Material
    UNSPECIFIED
  • Supply Voltage-Max (V)
    3.3
  • Supply Voltage-Min (V)
    2.6
  • Supply Voltage-Nom (V)
    3
  • Number of Words (words)
    2097152
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    250
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for CS26LV32163ZIP70

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
CS26LV32163ZIP70
Send an RFQ
CS26LV32163ZIP70