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COP210C-XXX/N

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP COP210C-XXX/N
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Bit Size
    4
  • CPU Family
    COP400
  • Technology
    CMOS
  • Width (mm)
    15.24
  • Length (mm)
    31.915
  • Speed (MHz)
    3.6
  • ADC Channels
    NO
  • DAC Channels
    NO
  • DMA Channels
    NO
  • JESD-30 Code
    R-PDIP-T24
  • PWM Channels
    NO
  • Package Code
    DIP
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of I/O Lines
    20
  • Number of Terminals
    24
  • Program Memory Type
    MROM
  • Terminal Pitch (mm)
    2.54
  • Data RAM Size (bytes)
    16
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    5.334
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    4
  • Package Equivalence Code
    DIP24,.6
  • Clock Frequency-Max (MHz)
    3.6
  • Program Memory Size (words)
    512
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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COP210C-XXX/N
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COP210C-XXX/N