CMP1617BA2-H70E

FIDELIX CO LTD

FIDELIX CO LTD CMP1617BA2-H70E
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Width (mm)
    6
  • Length (mm)
    8
  • JESD-30 Code
    R-PBGA-B48
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    PSEUDO STATIC RAM
  • Parallel/Serial
    PARALLEL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    48
  • Access Time-Max (ns)
    70
  • Memory Density (bits)
    16777216
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    3

0 suppliers available to buy or to bid for CMP1617BA2-H70E

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
CMP1617BA2-H70E
Send an RFQ
CMP1617BA2-H70E