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CDP1802ACD3

HARRIS SEMICONDUCTOR

HARRIS SEMICONDUCTOR CDP1802ACD3
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.15
  • SB Code
    8542.31.00.15
  • Format
    FIXED POINT
  • Bit Size
    8
  • Technology
    CMOS
  • RAM (words)
    0
  • Speed (MHz)
    3.6
  • JESD-30 Code
    R-CDIP-T40
  • Package Code
    DIP
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Low Power Mode
    NO
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Integrated Cache
    NO
  • Address Bus Width
    8
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Terminals
    40
  • Terminal Pitch (mm)
    2.54
  • Number of Serial I/Os
    0
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Number of DMA Channels
    1
  • On Chip Data RAM Width
    0
  • Supply Voltage-Max (V)
    6.5
  • Supply Voltage-Min (V)
    4
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    8
  • Supply Current-Max (mA)
    0.25
  • Package Equivalence Code
    DIP40,.6
  • Clock Frequency-Max (MHz)
    3.6
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR
  • Number of External Interrupts
    1
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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CDP1802ACD3
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CDP1802ACD3