ProductsManufacturers
Events
Send an RFQBOM Tool

CAT25C256LE-1.8-G

Catalyst Semiconductor, Inc.

Catalyst Semiconductor, Inc. CAT25C256LE-1.8-G
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    7.62
  • Length (mm)
    9.59
  • JESD-30 Code
    R-PDIP-T8
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e4
  • Memory IC Type
    EEPROM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Write Protection
    HARDWARE/SOFTWARE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    DUAL
  • Memory Organization
    32KX8
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    2.54
  • Number of Words Code
    32K
  • Memory Density (bits)
    262144
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.57
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    1.8
  • Supply Voltage-Nom (V)
    5
  • Data Retention Time-Min
    100
  • Number of Words (words)
    32768
  • Standby Current-Max (A)
    1.0E-5
  • Supply Current-Max (mA)
    10
  • Package Equivalence Code
    DIP8,.3
  • Clock Frequency-Max (MHz)
    0.2
  • Peak Reflow Temperature (Cel)
    260
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Write Cycle Time-Max (tWC) (ms)
    10
  • Screening Level / Reference Standard
    AEC-Q100
  • Time@Peak Reflow Temperature-Max (s)
    40

0 suppliers available to buy or to bid for CAT25C256LE-1.8-G

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
CAT25C256LE-1.8-G
Send an RFQ
CAT25C256LE-1.8-G