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BUF11705PWP

Texas Instruments Incorporated

Texas Instruments Incorporated BUF11705PWP
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Technology
    CMOS
  • Width (mm)
    4.4
  • Length (mm)
    9.7
  • JESD-30 Code
    R-PDSO-G28
  • Package Code
    HTSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    BUFFER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL EXTENDED
  • Terminal Position
    DUAL
  • Number of Functions
    10
  • Number of Terminals
    28
  • Terminal Pitch (mm)
    0.65
  • Slew Rate-Nom (V/us)
    4.6
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Nom (V)
    18
  • Supply Current-Max (mA)
    9
  • Bandwidth (3dB)-Nom (MHz)
    1
  • Supply Voltage Limit-Max (V)
    24
  • Input Offset Voltage-Max (uV)
    30000
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25
  • Average Bias Current-Max (IIB) (uA)
    0.0002

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BUF11705PWP
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BUF11705PWP