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BU9764FV-E2

ROHM Semiconductor

BU9764FV-E2 Datasheet
ROHM Semiconductor BU9764FV-E2
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width
    4.4 mm
  • Length
    5 mm
  • JESD-30 Code
    R-PDSO-G16
  • Package Code
    LSSOP
  • JESD-609 Code
    e3/e2
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Terminal Pitch
    0.65 mm
  • Terminal Finish
    TIN/TIN COPPER
  • Interface IC Type
    INTERFACE CIRCUIT
  • Seated Height-Max
    1.25 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    16
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    10

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BU9764FV-E2