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BU8313KVP

ROHM Semiconductor

ROHM Semiconductor BU8313KVP
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    10
  • Length (mm)
    10
  • JESD-30 Code
    S-PQFP-G44
  • Package Code
    QFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e3/e2
  • Telecom IC Type
    TELECOM CIRCUIT
  • Terminal Finish
    TIN/TIN COPPER
  • DLA Qualification
    Not Qualified
  • Terminal Position
    QUAD
  • Number of Functions
    1
  • Number of Terminals
    44
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.3
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    10

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BU8313KVP
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BU8313KVP