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BU8272GUW

ROHM Semiconductor

ROHM Semiconductor BU8272GUW
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Width (mm)
    4
  • Length (mm)
    4
  • JESD-30 Code
    S-PBGA-B35
  • Package Code
    VFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of Ports
    0
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of I/O Lines
    20
  • Number of Terminals
    35
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.9
  • Supply Voltage-Max (V)
    1.95
  • Supply Voltage-Min (V)
    1.65
  • Supply Voltage-Nom (V)
    1.8
  • External Data Bus Width
    0
  • Clock Frequency-Max (MHz)
    0.4
  • uPs/uCs/Peripheral ICs Type
    PARALLEL IO PORT, GENERAL PURPOSE
  • Peak Reflow Temperature (Cel)
    260

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BU8272GUW
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BU8272GUW