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BU7839GVW

ROHM Semiconductor

ROHM Semiconductor BU7839GVW
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Width (mm)
    4
  • Length (mm)
    4
  • JESD-30 Code
    S-PBGA-B24
  • Package Code
    VFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Consumer IC Type
    CLASS D AUDIO AMPLIFIER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    IT REQUIRES DIGITAL SUPPLY OF 1.35V TO 1.65V
  • Number of Channels
    2
  • Number of Functions
    1
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.9
  • Supply Voltage-Max (V)
    3
  • Supply Voltage-Min (V)
    2.5
  • Supply Current-Max (mA)
    6
  • Package Equivalence Code
    BGA24,5X5,25
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -30

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BU7839GVW
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BU7839GVW