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BU2362FV

ROHM Semiconductor

ROHM Semiconductor BU2362FV
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Width (mm)
    4.4
  • Length (mm)
    5
  • JESD-30 Code
    R-PDSO-G16
  • Package Code
    LSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e2
  • Terminal Finish
    Tin/Copper (Sn/Cu)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL EXTENDED
  • Terminal Position
    DUAL
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.35
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3.3
  • Supply Current-Max (mA)
    45
  • Package Equivalence Code
    TSSOP16,.25
  • uPs/uCs/Peripheral ICs Type
    CLOCK GENERATOR, OTHER
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25
  • Output Clock Frequency-Max (MHz)
    36.8688
  • Primary Clock/Crystal Frequency-Nom (MHz)
    27

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BU2362FV
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BU2362FV