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BU-65844RC-E02

DATA DEVICE CORP

DATA DEVICE CORP BU-65844RC-E02
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    20.7
  • Length (mm)
    20.7
  • RAM (words)
    4096
  • JESD-30 Code
    S-PBGA-B324
  • Package Code
    BGA
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Address Bus Width
    32
  • Bus Compatibility
    PCI
  • Terminal Position
    BOTTOM
  • Number of Terminals
    324
  • Terminal Pitch (mm)
    1
  • Number of Serial I/Os
    2
  • Package Body Material
    PLASTIC/EPOXY
  • Communication Standard
    MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838
  • On Chip Data RAM Width
    16
  • Seated Height-Max (mm)
    3.05
  • Supply Voltage-Max (V)
    3.46
  • Supply Voltage-Min (V)
    3.14
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    32
  • Package Equivalence Code
    BGA324,18X18,40
  • Clock Frequency-Max (MHz)
    33
  • uPs/uCs/Peripheral ICs Type
    SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
  • Data Encoding/Decoding Method
    BIPH-LEVEL(MANCHESTER)
  • Data Transfer Rate-Max (MBps)
    1
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40

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BU-65844RC-E02
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BU-65844RC-E02