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BU-64863U8-E02

DATA DEVICE CORP

DATA DEVICE CORP BU-64863U8-E02
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    HYBRID
  • Width (mm)
    15.2
  • Length (mm)
    27.9
  • RAM (words)
    8192
  • JESD-30 Code
    R-PBGA-B312
  • Package Code
    BGA
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Low Power Mode
    YES
  • Terminal Finish
    TIN SILVER COPPER
  • Address Bus Width
    16
  • Bus Compatibility
    MIL-STD-1553
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    312
  • Terminal Pitch (mm)
    1
  • Number of Serial I/Os
    2
  • Package Body Material
    PLASTIC/EPOXY
  • Communication Standard
    MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838
  • On Chip Data RAM Width
    16
  • Seated Height-Max (mm)
    4.7
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    16
  • Supply Current-Max (mA)
    937
  • Package Equivalence Code
    BGA312,13X24,40
  • Clock Frequency-Max (MHz)
    20
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
  • Data Encoding/Decoding Method
    BIPH-LEVEL(MANCHESTER)
  • Data Transfer Rate-Max (MBps)
    1
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    MIL-STD-883
  • Time@Peak Reflow Temperature-Max (s)
    30

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BU-64863U8-E02
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BU-64863U8-E02