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BD74C08FV-CE2

ROHM Semiconductor

ROHM Semiconductor BD74C08FV-CE2
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Family
    CMOS
  • Technology
    CMOS
  • Width (mm)
    4.4
  • Length (mm)
    5
  • JESD-30 Code
    R-PDSO-G14
  • Package Code
    LSSOP
  • Logic IC Type
    AND GATE
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Packing Method
    EMBOSSED; TR
  • Schmitt Trigger
    NO
  • Number of Inputs
    2
  • Terminal Position
    DUAL
  • Number of Functions
    4
  • Number of Terminals
    14
  • Terminal Pitch (mm)
    0.65
  • Load Capacitance (pF)
    50
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (ns)
    15
  • Seated Height-Max (mm)
    1.35
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    1.65
  • Supply Voltage-Nom (V)
    3.3
  • Supply Current-Max (mA)
    50
  • Package Equivalence Code
    SSOP14,.25
  • Output Low Current-Max (mA)
    8
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Propagation Delay-Max@Nom-Sup (ns)
    12
  • Screening Level / Reference Standard
    AEC-Q100

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BD74C08FV-CE2
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BD74C08FV-CE2