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BD6074GUT-E2

ROHM Semiconductor

ROHM Semiconductor BD6074GUT-E2
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    S-PBGA-B8
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • DLA Qualification
    Not Qualified
  • Interface IC Type
    LED DISPLAY DRIVER
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA8,3X3,20
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -30
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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BD6074GUT-E2
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BD6074GUT-E2