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BD6025GU

ROHM Semiconductor

BD6025GU Datasheet
ROHM Semiconductor BD6025GU
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Width (mm)
    5.3
  • Length (mm)
    5.3
  • JESD-30 Code
    S-XBGA-B64
  • Package Code
    VFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO REQUIRES 1.62V TO 3.3V IO SUPPLY
  • Number of Functions
    1
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    UNSPECIFIED
  • Analog IC - Other Type
    ANALOG CIRCUIT
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    4.5
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3.6
  • Supply Current-Max (mA)
    33
  • Package Equivalence Code
    BGA64,10X10,20
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -30

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BD6025GU
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BD6025GU