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BA6569AFP

ROHM Semiconductor

ROHM Semiconductor BA6569AFP
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    BIPOLAR
  • Width (mm)
    5.4
  • Length (mm)
    13.6
  • JESD-30 Code
    R-PDSO-G26
  • Package Code
    HSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e3/e2
  • Telecom IC Type
    TELEPHONE SPEECH CIRCUIT
  • Terminal Finish
    TIN/TIN COPPER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    26
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.11
  • Supply Current-Max (mA)
    0.12
  • Package Equivalence Code
    SOP32,.3,32
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    60
  • Operating Temperature-Min (Cel)
    -25
  • Time@Peak Reflow Temperature-Max (s)
    10

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BA6569AFP
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BA6569AFP