TDK Corporation B30921D7022Y918
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    9.3
  • Length (mm)
    10.5
  • JESD-30 Code
    R-XBGA-B168
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Telecom IC Type
    WIRELESS LAN CIRCUIT
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    168
  • Package Body Material
    UNSPECIFIED
  • Seated Height-Max (mm)
    1.4
  • Supply Voltage-Nom (V)
    1.8
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -30

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B30921D7022Y918