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B30911D7021Y918

TDK Corporation

TDK Corporation B30911D7021Y918
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width
    9.3 mm
  • Length
    10.5 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-XBGA-B168
  • Package Code
    LFLGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BUTT
  • Terminal Pitch
    0.7 mm
  • Telecom IC Type
    WIRELESS LAN CIRCUIT
  • Seated Height-Max
    1.4 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Supply Voltage-Nom
    1.8 V
  • Number of Functions
    1
  • Number of Terminals
    168
  • Package Body Material
    UNSPECIFIED
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel

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B30911D7021Y918
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B30911D7021Y918