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AU1550500MBI

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AU1550500MBI
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Format
    FLOATING POINT
  • Technology
    CMOS
  • Width (mm)
    21
  • Length (mm)
    21
  • Speed (MHz)
    500
  • JESD-30 Code
    S-PBGA-B483
  • Package Code
    LFBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    NO
  • Integrated Cache
    NO
  • Address Bus Width
    24
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    483
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.7
  • Supply Voltage-Max (V)
    3.3
  • Supply Voltage-Min (V)
    2.5
  • External Data Bus Width
    26
  • Clock Frequency-Max (MHz)
    500
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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AU1550500MBI
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AU1550500MBI