ProductsManufacturers
Events
Send an RFQBOM Tool

AU1100500MBC

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AU1100500MBC
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.25
  • Format
    FIXED POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    17
  • Length (mm)
    17
  • Speed (MHz)
    500
  • JESD-30 Code
    S-PBGA-B399
  • Package Code
    LFBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Integrated Cache
    YES
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO REQUIRES 3.3V SUPPLY
  • Number of Terminals
    399
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.7
  • Supply Voltage-Max (V)
    1.32
  • Supply Voltage-Min (V)
    1.12
  • Supply Voltage-Nom (V)
    1.22
  • External Data Bus Width
    32
  • Package Equivalence Code
    BGA399,20X20,32
  • Clock Frequency-Max (MHz)
    15
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

0 suppliers available to buy or to bid for AU1100500MBC

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
AU1100500MBC
Send an RFQ
AU1100500MBC