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AS9C25256M2018L-133FI

Alliance Semiconductor Corporation

Alliance Semiconductor Corporation AS9C25256M2018L-133FI
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Width (mm)
    15
  • Length (mm)
    15
  • JESD-30 Code
    S-PBGA-B208
  • Memory Width
    18
  • Package Code
    LFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Memory IC Type
    MULTI-PORT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    FLOW-THROUGH OR PIPELINED ARCHITECTURE
  • Memory Organization
    256KX18
  • Number of Functions
    1
  • Number of Terminals
    208
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    12
  • Number of Words Code
    256K
  • Memory Density (bits)
    4718592
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.4
  • Supply Voltage-Max (V)
    2.6
  • Supply Voltage-Min (V)
    2.4
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    262144
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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AS9C25256M2018L-133FI