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AS8S512K32P-20/AT

MICROSS COMPONENTS

MICROSS COMPONENTS AS8S512K32P-20/AT
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    S-XPGA-P66
  • Memory Width
    32
  • Package Code
    PGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    PERPENDICULAR
  • Memory Organization
    512KX32
  • Number of Terminals
    66
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    20
  • Number of Words Code
    512K
  • Memory Density (bits)
    16777216
  • Package Body Material
    CERAMIC
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    524288
  • Standby Current-Max (A)
    0.02
  • Standby Voltage-Min (V)
    2
  • Supply Current-Max (mA)
    650
  • Package Equivalence Code
    PGA66,11X11
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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AS8S512K32P-20/AT