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AS8S128K32-25

MICROSS COMPONENTS

MICROSS COMPONENTS AS8S128K32-25
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Width (mm)
    27.305
  • Length (mm)
    27.305
  • JESD-30 Code
    S-CHMA-P66
  • Memory Width
    8
  • Package Code
    PGA
  • Package Shape
    SQUARE
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    HEX
  • Additional Feature
    USER CONFIGURABLE 256K X 16; TTL COMPATIBLE INPUTS/OUTPUTS
  • Memory Organization
    512KX8
  • Number of Functions
    1
  • Number of Terminals
    66
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    25
  • Number of Words Code
    512K
  • Memory Density (bits)
    4194304
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    524288
  • Supply Current-Max (mA)
    560
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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AS8S128K32-25
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AS8S128K32-25