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AS8FLC1M32BQ-90/IT

MICROSS COMPONENTS

MICROSS COMPONENTS AS8FLC1M32BQ-90/IT
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM
  • Technology
    CMOS
  • JESD-30 Code
    R-CQFP-G68
  • Memory Width
    32
  • Organization
    1MX32
  • Package Code
    QFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    33554432 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    90 ns
  • Number of Words
    1048576 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    3.556 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Additional Feature
    BOTTOM BOOT BLOCK
  • Number of Functions
    1
  • Number of Terminals
    68
  • Programming Voltage
    3 V
  • Number of Words Code
    1M
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

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AS8FLC1M32BQ-90/IT