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AS8E128K32Q-15

MICROSS COMPONENTS

MICROSS COMPONENTS AS8E128K32Q-15
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Data Polling
    YES
  • JESD-30 Code
    S-XQFP-G68
  • Memory Width
    32
  • Package Code
    QFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    EEPROM MODULE
  • Parallel/Serial
    PARALLEL
  • Write Protection
    SOFTWARE
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    128
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Memory Organization
    128KX32
  • Number of Terminals
    68
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    150
  • Number of Words Code
    128K
  • Memory Density (bits)
    4194304
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    131072
  • Standby Current-Max (A)
    0.001
  • Supply Current-Max (mA)
    250
  • Package Equivalence Code
    QFP68,.99SQ,50
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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AS8E128K32Q-15