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AS58LC1001DCJ-25/883C

MICROSS COMPONENTS

MICROSS COMPONENTS AS58LC1001DCJ-25/883C
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Width (mm)
    11.049
  • Length (mm)
    20.955
  • Data Polling
    YES
  • JESD-30 Code
    R-CDSO-J32
  • Memory Width
    8
  • Package Code
    SOJ
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • J-STD-609 Code
    e0
  • Memory IC Type
    EEPROM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    128
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    128KX8
  • Number of Functions
    1
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    250
  • Number of Words Code
    128K
  • Memory Density (bits)
    1048576
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Command User Interface
    NO
  • Seated Height-Max (mm)
    3.6068
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    131072
  • Programming Voltage (V)
    3
  • Standby Current-Max (A)
    0.0001
  • Supply Current-Max (mA)
    20
  • Package Equivalence Code
    SOJ32,.44
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Write Cycle Time-Max (tWC) (ms)
    15
  • Screening Level / Reference Standard
    MIL-STD-883 Class B

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AS58LC1001DCJ-25/883C
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AS58LC1001DCJ-25/883C