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AS4SD32M16DGC-75/XT

MICROSS COMPONENTS

MICROSS COMPONENTS AS4SD32M16DGC-75/XT
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.28
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    10.16
  • Access Mode
    FOUR BANK PAGE BURST
  • Length (mm)
    22.22
  • JESD-30 Code
    R-PDSO-G54
  • Memory Width
    16
  • Package Code
    TSOP2
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    SYNCHRONOUS DRAM
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    8192
  • Number of Ports
    1
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Additional Feature
    AUTO/SELF REFRESH
  • Memory Organization
    32MX16
  • Number of Functions
    1
  • Number of Terminals
    54
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    5.4
  • Number of Words Code
    32M
  • Memory Density (bits)
    536870912
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    33554432
  • Sequential Burst Length
    1,2,4,8,FP
  • Standby Current-Max (A)
    0.05
  • Supply Current-Max (mA)
    300
  • Interleaved Burst Length
    1,2,4,8
  • Package Equivalence Code
    TSOP54,.46,32
  • Clock Frequency-Max (MHz)
    133
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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AS4SD32M16DGC-75/XT
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AS4SD32M16DGC-75/XT