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AS358MM-E1

BCD Semiconductor Manufacturing Limited

BCD Semiconductor Manufacturing Limited AS358MM-E1
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Power
    NO
  • Low-Bias
    NO
  • Wideband
    NO
  • Low-Offset
    NO
  • Micropower
    NO
  • Technology
    BIPOLAR
  • Width (mm)
    3
  • Length (mm)
    3
  • JESD-30 Code
    S-PDSO-G8
  • Package Code
    TSSOP
  • Package Shape
    SQUARE
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • Packing Method
    TUBE
  • Amp Architecture
    VOLTAGE-FEEDBACK
  • Voltage Gain-Min
    10000
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Programmable Power
    NO
  • Number of Functions
    2
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Frequency Compensation
    YES
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    2
  • Package Equivalence Code
    TSSOP8,.19
  • Supply Voltage Limit-Max (V)
    40
  • Input Offset Voltage-Max (uV)
    5000
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Bias Current-Max (IIB) @25C (uA)
    0.2
  • Common-mode Reject Ratio-Nom (dB)
    70
  • Average Bias Current-Max (IIB) (uA)
    0.2
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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AS358MM-E1
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AS358MM-E1