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AP3064P-G1

BCD Semiconductor Manufacturing Limited

BCD Semiconductor Manufacturing Limited AP3064P-G1
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    7.62
  • Length (mm)
    19
  • JESD-30 Code
    R-PDIP-T16
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e3
  • fmax-Min (MHz)
    1
  • Terminal Finish
    MATTE TIN
  • Interface IC Type
    LED DISPLAY DRIVER
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Segments
    52
  • Number of Functions
    1
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.31
  • Supply Voltage-Max (V)
    33
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    24
  • Package Equivalence Code
    DIP16,.3
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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AP3064P-G1
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AP3064P-G1