ProductsManufacturers
Events
Send an RFQBOM Tool

AM29LV116DB-120EF

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM29LV116DB-120EF
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Data Polling
    YES
  • JESD-30 Code
    R-PDSO-G40
  • Memory Width
    8
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    FLASH
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    2MX8
  • Number of Terminals
    40
  • Sector Size (words)
    16K,8K,32K,64K
  • Terminal Pitch (mm)
    0.5
  • Access Time-Max (ns)
    120
  • Number of Words Code
    2M
  • Memory Density (bits)
    16777216
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Common Flash Interface
    YES
  • Number of Sectors/Size
    1,2,1,31
  • Number of Words (words)
    2097152
  • Standby Current-Max (A)
    5.0E-6
  • Supply Current-Max (mA)
    30
  • Package Equivalence Code
    TSSOP40,.8,20
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for AM29LV116DB-120EF

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
AM29LV116DB-120EF
Send an RFQ
AM29LV116DB-120EF