AM29DL800B-100UAC by Advanced Micro Devices, Inc. (AMD) | Sourcengine

Advanced Micro Devices, Inc. (AMD) AM29DL800B-100UAC

Lifecycle status
Transferred
Description
Flash, 1MX8, 100ns, PBGA48
Category
Semiconductors Memory ICs Flash Memories FLASH

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NOR TYPE
Boot Block
BOTTOM
Ready/Busy
YES
Technology
CMOS
Toggle Bit
YES
Width (mm)
5.6
Length (mm)
11.25
Data Polling
YES
JESD-30 Code
R-PBGA-B48
Memory Width
8
Package Code
TFBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
FLASH
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
CONFIGURABLE AS 512K X 16
Memory Organization
1MX8
Number of Functions
1
Number of Terminals
48
Sector Size (words)
16K,8K,32K,64K
Terminal Pitch (mm)
0.65
Access Time-Max (ns)
100
Number of Words Code
1M
Memory Density (bits)
8388608
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
8
Command User Interface
YES
Number of Sectors/Size
2,4,2,14
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.1
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
2.7
Supply Voltage-Nom (V)
3.3
Number of Words (words)
1048576
Programming Voltage (V)
3
Standby Current-Max (A)
5.0E-6
Supply Current-Max (mA)
45
Package Equivalence Code
BGA44,8X6,25
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0