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AM29BL162CB65REE

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM29BL162CB65REE
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Data Polling
    YES
  • JESD-30 Code
    R-PDSO-G56
  • Memory Width
    16
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Additional Feature
    20-YEAR DATA RETENTION
  • Memory Organization
    1MX16
  • Number of Functions
    1
  • Number of Terminals
    56
  • Sector Size (words)
    8K,4K,112K,128K
  • Access Time-Max (ns)
    65
  • Number of Words Code
    1M
  • Memory Density (bits)
    16777216
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Common Flash Interface
    YES
  • Number of Sectors/Size
    1,2,1,7
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3
  • Data Retention Time-Min
    20
  • Number of Words (words)
    1048576
  • Programming Voltage (V)
    3
  • Package Equivalence Code
    TSOP56(UNSPEC)
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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AM29BL162CB65REE