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AM29524/BXC

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM29524/BXC
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Technology
    ECL
  • Width (mm)
    10.16
  • Length (mm)
    35.56
  • JESD-30 Code
    R-CDIP-T28
  • Package Code
    DIP
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Low Power Mode
    NO
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Terminals
    28
  • Terminal Pitch (mm)
    2.54
  • Output Data Bus Width
    8
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    4.445
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    8
  • Package Equivalence Code
    DIP28,.4
  • uPs/uCs/Peripheral ICs Type
    DSP PERIPHERAL, PIPELINE REGISTER
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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AM29524/BXC
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AM29524/BXC