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AM27X2048-155XC

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM27X2048-155XC
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-XUUC-N40
  • Memory Width
    16
  • Package Code
    DIE
  • Package Shape
    RECTANGULAR
  • Package Style
    UNCASED CHIP Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Terminal Position
    UPPER
  • Memory Organization
    128KX16
  • Number of Functions
    1
  • Number of Terminals
    40
  • Access Time-Max (ns)
    150
  • Number of Words Code
    128K
  • Memory Density (bits)
    2097152
  • Package Body Material
    UNSPECIFIED
  • Output Characteristics
    3-STATE
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    131072
  • Standby Current-Max (A)
    0.0001
  • Supply Current-Max (mA)
    50
  • Package Equivalence Code
    DIE OR CHIP
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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AM27X2048-155XC
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AM27X2048-155XC