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AM27X010-250XC

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM27X010-250XC
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-XUUC-N31
  • Memory Width
    8
  • Organization
    128KX8
  • Package Code
    DIE
  • Package Shape
    RECTANGULAR
  • Package Style
    UNCASED CHIP Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory Density
    1048576 bit
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Access Time-Max
    250 ns
  • Number of Words
    131072 words
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    UPPER
  • Supply Current-Max
    30 mA
  • Number of Functions
    1
  • Number of Terminals
    31
  • Standby Current-Max
    0.0001 Amp
  • Number of Words Code
    128K
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIE OR CHIP
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V

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AM27X010-250XC
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AM27X010-250XC