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AM27S25SA/BUA

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM27S25SA/BUA
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    BIPOLAR
  • Width (mm)
    11.43
  • Length (mm)
    13.97
  • JESD-30 Code
    R-CQCC-N32
  • Memory Width
    8
  • Package Code
    QCCN
  • Package Shape
    RECTANGULAR
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory IC Type
    OTP ROM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Memory Organization
    512X8
  • Number of Functions
    1
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    15
  • Number of Words Code
    512
  • Memory Density (bits)
    4096
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    2.54
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    512
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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AM27S25SA/BUA