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AM27S19AFMB

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM27S19AFMB
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    TTL
  • JESD-30 Code
    R-XDFP-F16
  • Memory Width
    8
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Memory IC Type
    FLASH
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    32X8
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    35
  • Number of Words Code
    32
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    32
  • Package Equivalence Code
    FL16,.3
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883 Class B (Modified)

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AM27S19AFMB
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AM27S19AFMB