AM27S13ADCB by Advanced Micro Devices, Inc. (AMD) | Sourcengine

Advanced Micro Devices, Inc. (AMD) AM27S13ADCB

Lifecycle status
Discontinued
Description
OTP ROM, 128KX1, 30ns, Bipolar, CDIP16
Category
Semiconductors Memory ICs OTP ROMs OTP ROM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
BIPOLAR
Width (mm)
7.62
Length (mm)
19.431
JESD-30 Code
R-GDIP-T16
Memory Width
1
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
J-STD-609 Code
e0
Memory IC Type
OTP ROM
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL EXTENDED
Terminal Position
DUAL
Memory Organization
128KX1
Number of Functions
1
Number of Terminals
16
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
30
Number of Words Code
128K
Memory Density (bits)
131072
Package Body Material
CERAMIC, GLASS-SEALED
Output Characteristics
3-STATE
Seated Height-Max (mm)
5.08
Supply Voltage-Max (V)
5.25
Supply Voltage-Min (V)
4.75
Supply Voltage-Nom (V)
5
Number of Words (words)
512
Supply Current-Max (mA)
130
Package Equivalence Code
DIP16,.3
Operating Temperature-Max (Cel)
75
Operating Temperature-Min (Cel)
0