Advanced Micro Devices, Inc. (AMD) AM27LS19DMB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    TTL
  • JESD-30 Code
    R-XDIP-T16
  • Memory Width
    8
  • Organization
    32X8
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    MEMORY CIRCUIT
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    70 ns
  • Number of Words
    32 words
  • Screening Level
    MIL-STD-883 Class B (Modified)
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Supply Current-Max
    80 mA
  • Number of Terminals
    16
  • Number of Words Code
    32
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    DIP16,.3
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Nom (Vsup)
    5 V

0 suppliers available to buy or to bid for AM27LS19DMB

Send an RFQ

Your RFQ will be directly sent to our expert: Ayesha

Send an RFQ
AM27LS19DMB
Send an RFQ
AM27LS19DMB