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AM27LS18PCB

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM27LS18PCB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    BIPOLAR
  • Width (mm)
    7.62
  • Length (mm)
    19.1135
  • JESD-30 Code
    R-PDIP-T16
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    OTP ROM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL EXTENDED
  • Terminal Position
    DUAL
  • Memory Organization
    1KX8
  • Number of Functions
    1
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    25
  • Number of Words Code
    1K
  • Memory Density (bits)
    8192
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    OPEN-COLLECTOR
  • Seated Height-Max (mm)
    5.08
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    32
  • Package Equivalence Code
    DIP16,.3
  • Operating Temperature-Max (Cel)
    75
  • Operating Temperature-Min (Cel)
    0

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AM27LS18PCB
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AM27LS18PCB