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AM27LS18FC

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM27LS18FC
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    6.731 mm
  • Length
    10.16 mm
  • Technology
    BIPOLAR
  • JESD-30 Code
    R-CDFP-F16
  • Memory Width
    8
  • Organization
    32X8
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory Density
    256 bit
  • Memory IC Type
    OTP ROM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    55 ns
  • Number of Words
    32 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    2.159 mm
  • Temperature Grade
    COMMERCIAL EXTENDED
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    16
  • Number of Words Code
    32
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Output Characteristics
    OPEN-COLLECTOR
  • Operating Temperature-Max
    75 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    5.25 V
  • Supply Voltage-Min (Vsup)
    4.75 V
  • Supply Voltage-Nom (Vsup)
    5 V

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AM27LS18FC
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AM27LS18FC