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AM27C256-170DIB

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM27C256-170DIB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.61
  • SB Code
    8542.32.00.60
  • Width
    15.24 mm
  • Length
    37.1475 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-GDIP-T28
  • Memory Width
    8
  • Organization
    32KX8
  • Package Code
    WDIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE, WINDOW Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    262144 bit
  • Memory IC Type
    UVPROM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    170 ns
  • Number of Words
    32768 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    5.588 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    28
  • Number of Words Code
    32K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Output Characteristics
    3-STATE
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V

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AM27C256-170DIB
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AM27C256-170DIB