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AF82US15W

Intel Corporation

Intel Corporation AF82US15W
  • ECCN
    4A994
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B1249
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1249
  • Terminal Pitch (mm)
    0.4
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA1249,50X50,16
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT

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AF82US15W
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AF82US15W