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AEPSZ16K32/818-25

ADVANCED ELECTRONIC PACKAGING

ADVANCED ELECTRONIC PACKAGING AEPSZ16K32/818-25
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    R-XZMA-T73
  • Memory Width
    32
  • Organization
    16KX32
  • Output Enable
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    524288 bit
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    1
  • Number of Words
    16384 words
  • Parallel/Serial
    PARALLEL
  • Terminal Position
    ZIG-ZAG
  • Number of Functions
    1
  • Number of Terminals
    73
  • Number of Words Code
    16K
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Supply Voltage-Nom (Vsup)
    5 V

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AEPSZ16K32/818-25
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AEPSZ16K32/818-25