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ADSP-CM409CBCZ-AF

Analog Devices, Inc.

Analog Devices, Inc. ADSP-CM409CBCZ-AF
  • ECCN
    3A991.A.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    19
  • Length (mm)
    19
  • RAM (words)
    393216
  • JESD-30 Code
    S-PBGA-B212
  • Package Code
    LBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Barrel Shifter
    NO
  • Low Power Mode
    YES
  • Integrated Cache
    YES
  • Number of Timers
    11
  • Address Bus Width
    24
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    212
  • Program Memory Type
    FLASH
  • Terminal Pitch (mm)
    1
  • Number of Serial I/Os
    6
  • Package Body Material
    PLASTIC/EPOXY
  • Number of DMA Channels
    17
  • On Chip Data RAM Width
    8
  • Seated Height-Max (mm)
    1.7
  • Supply Voltage-Max (V)
    1.26
  • Supply Voltage-Min (V)
    1.14
  • Supply Voltage-Nom (V)
    1.2
  • External Data Bus Width
    16
  • Package Equivalence Code
    BGA212,18X18,40
  • Clock Frequency-Max (MHz)
    60
  • Internal Bus Architecture
    MULTIPLE
  • Moisture Sensitivity Level
    3
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, CONTROLLER
  • Number of External Interrupts
    6
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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ADSP-CM409CBCZ-AF